I think you'll need an expert opinion. My minor trace lifting was on the component side, caused by pulling the component off (the solder on the component side stuck to the surface of the through-hole plating). But it was minor and the trace was intact so I just made sure the solder wetted the hole, the trace connection to the hole, and up onto the component lead. In my case a solid solder connection to the hole/trace junction seemed to work out fine. It was very minor lifting.