This guide sort of sucks...
http://www.infidigm.net/articles/solder/0805 capacitors... The way you are suppose to remove them is with two soldering irons.
SOIC removal... If you simply DO NOT CARE about the part there is a much better way. Get a sharp pocket knife or razer blade and cut all of the leads as close to the SOIC itself as you can. Then you just dip your soldering iron in the solder and wick out the remaining chunk of lead. This is very easy as it will stick to your soldering iron. Then to install the next part you can clean the board off or just slowly heat and push it in if you do not have any methods of cleaning. This tool kicks ass by the way...
http://www.partsexpress.com/pe/showdetl.cfm?&Partnumber=370-325If you do choose the flood method... You need to scrape under the chip for any resin, and then use a stiff brush (I use a toothbrush) with some isopropolyne alcohol to clean it up after. If you do not and you replace the chip then there is the possibility of shorting one side out to the other via resin that conducts (good resin does).
When ever you solder something like a SOIC that has leads that are very close together you need to use a pocket knife or razor blade to cut and scrape out inbetween the leads as best as possible, and then use isopropolyne alcohol and a stiff brush to clean up the resin that comes off. Again if you have good solder you will have resin (WBT or Cardas). Also if you get too much solder on (two leads connected), use a solder sucker to take up some. Then reheat both sides, and if you removed enough the solder will seperate to each lead and not connect in the middle. At this point scraping out inbetween is a must.
Careful technique to apply that is almost plain nuts... If you are touching a SOIC lead what you can do is have the soldering iron fairly straight up, and rather than trying to push the solder directly onto the lead, inbetween the soldering iron and it, put a VERY small dab on the soldering iron so it barely touches the lead. What will happen is it will bead on the soldering iron, but as soon as the lead is hot it will fall onto it and around it. This is TRICKY and does not always work in the way you hope. There are times when you need to add more solder. The point of this is to prevent a cold solder joint (BAD thing). A reason to do this is because unless you got a magnifing glass it might be HARD to see the solder "fall" into place (signifies just enough heat) on the leads when you pushed it on.
Tools I want in the future... Soldering iron forks with 8 leads for SOIC opamps, and then maybe a couple more semi-standard sized IC ones. It would looks crazy but it is possible. What would make it the best is if the fork could have a closing mechanism so you just press and grab all eight leads and lift!

well it sounds like fun