Per experience with one premier audio designer and a team of designers including HP's former top trouble shooter (final diagnostician for the Pentium chip prior to release), it is difficult to overstate audio performance upgrade via mechanical damping (clear silicone sealant, epoxy, etc.) applied to caps, fuses, chassis, resistors, transistors, etc.
I consider applying silicone around OEM Hypex Ncore fuse. How likely would silicone trap heat, thus causing premature failure?