I just wanted to underscore that I'm not really worried about the heat issue, at least in my implementation. I would worry about putting them in really tight chassis, with materials that don't allow heat to escape well, etc, but that's not my situation. Mine are good size, all aluminum, and vented on the top plate.
I'm really just interested in getting a firm grip on what the power and heat parameters really are in the real world. Also I'd like to know if I should make any adjustments of my own to further optimize. Those CPU heatsinks could be really handy, but the SMPS doesn't seem to be the problem child for me that it is for others. Would it make sense for me to apply those heatsinks to the electrolytic caps on the modules? That's where it's hottest right now in my implementation, and where the highest heat seemed to be in the calibrated measurements several posts ago.
Or maybe I don't have my modules coupled properly to the chassis after all? I mean, I think they're pretty firmly physically connected, but maybe there's a slight physical gap? Or maybe that silver thermal compound doesn't work as well as they say, and I actually created more of a barrier to thermal conductivity by using it?